Title:
基板処理チャンバ用の熱的に適合したサポートリング
Document Type and Number:
Japanese Patent JP3109840
Kind Code:
U
Abstract:
A substrate support ring has a band having an inner perimeter that at least partially surrounds a periphery of the substrate. The band has a radiation absorption surface. A lip extends radially inwardly from the inner perimeter of the band to support the substrate. The band and lip can be formed from silicon carbide, and the radiation absorption surface can be an oxidized layer of silicon carbide. In one version, the band and lip have a combined thermal mass Tm, and the radiation absorption surface has an absorptivity A and a surface area Sa, such that the ratio (AxSa)/Tm is from about 4x10-5 m2K/J to about 9x10-4 m2K/J.
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Inventors:
Joseph M. Rainish
Aaron Muir Hunter
Balas Bramanian Ramachandran
Jarepari Ravi
Thunder Rama Mercy
Vedapram es.
Carshed Solage
Aaron Muir Hunter
Balas Bramanian Ramachandran
Jarepari Ravi
Thunder Rama Mercy
Vedapram es.
Carshed Solage
Application Number:
JP2005000112U
Publication Date:
June 02, 2005
Filing Date:
January 14, 2005
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
F27B5/14; F27B17/00; F27D5/00; F27D19/00; F27D21/00; H01L21/687; (IPC1-7): H01L21/68; H01L21/26
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yuichi Yamada