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Title:
THERMALLY ADHESIVE POLYIMIDE RESIN TAPE
Document Type and Number:
Japanese Patent JPH0292978
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject tape having excellent heat-resistance and high adhesivity to an adhered and exhibiting little change of the adhesivity with time by forming an adhesive layer composed of a specific acrylic acid ester copolymer and a thermosetting resin on a polyimide film substrate.

CONSTITUTION: The objective tape having tack-free adhesive layer and developing strong adhesive force by bonding under heating is produced by forming an adhesive layer composed of (A) 100 pts.wt. of an acrylic acid ester copolymer containing (i) ≥40wt.% of methyl acrylate and/or ethyl acrylate and (ii) 0.01-10wt.% of a compound having a reactive double bond and a group selected from epoxy group, carboxyl group and hydroxyl group and (B) 5-50 pts.wt. of a thermosetting resin having a gel-time of ≥60sec measured in accordance with JIS-K-6910 to at least one surface of a polyimide film substrate.


Inventors:
OKADA YUKO
Application Number:
JP24537788A
Publication Date:
April 03, 1990
Filing Date:
September 29, 1988
Export Citation:
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Assignee:
SOKEN KAGAKU KK
International Classes:
C08L33/08; C08F20/10; C08F220/12; C08L33/04; C09J7/02; C09J133/04; C09J133/08; (IPC1-7): C08F220/12; C08L33/08; C09J7/02; C09J133/08
Domestic Patent References:
JPS5034640A1975-04-03
JPS6456779A1989-03-03
Attorney, Agent or Firm:
Shunichiro Suzuki



 
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