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Title:
THERMALLY BLOCKING COMPOSITION, THERMALLY BLOCKING DEVICE, AND MANUFACTURING PROCESS OF THERMALLY BLOCKING DEVICE
Document Type and Number:
Japanese Patent JP2002163966
Kind Code:
A
Abstract:

To provide an effective thermally blocking composition in which a superior chemical and thermal stability is shown in a thermally blocking structure and which is non-electroconductive in a fused state, and in which a range of fusing temperature is defined.

A thermally blocking member and a composition used to produce the member have at least two organic compounds. When these compounds are fully bound, a component having a lower fusing transition temperature than that of the organic compound in the initial period before binding. The thermally blocking member is generally utilized in the thermally blocking structure having an electrically switching unit, and this electrically switching unit changes its actuation condition in case it is fused by heating up to a certain temperature against a specific material constituting the member in which the thermally blocking member is utilized.


Inventors:
CHRISTINE M HUDSON
Application Number:
JP2001277060A
Publication Date:
June 07, 2002
Filing Date:
September 12, 2001
Export Citation:
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Assignee:
THERM O DISC INC
International Classes:
H01H37/76; C07D207/404; C07D209/08; C07D213/82; C07D231/12; C07D233/54; C07D235/18; C07D239/46; C07D239/48; C07D239/62; C07D241/44; C07D251/18; C07D311/20; C07D409/12; C07D473/04; H01H37/36; C07D207/40; (IPC1-7): H01H37/76
Attorney, Agent or Firm:
Atsushi Nakajima (2 outside)



 
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