Title:
THERMALLY CONDUCTING MOLD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016092227
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique which contributes to the enhancement in thermal conductivity, adhesion and vibration resistance for a thermally conducting mold.SOLUTION: A method for manufacturing a thermally conducting mold 1 comprises the steps of: preparing a composition by adding an inorganic filler with high thermal conductivity to a resin base material made into a mixture and kneading the mixture; filling the composition in a tray concave portion 23 of a heat resistant tray 21; and hermetically sealing the tray concave portion 23 by a laminate film 51 and in this state, curing the composition by heating. With the aid of the tray concave portion 23, the thermally conducting mold 1 is arranged into a form (having a concave portion 11) which allows the mold to cover an electronic element 71 as an exothermic body. In this way, a thermally conducting mold 1 having a form which allows the mold to over the electronic element 71 can be molded readily, and a thermally conducting mold larger in thickness than that obtained by shaping by coating can be shaped. Thus, both of the increase in adhesion of a thermally conducting mold 1, and the enhancement in vibration resistance can be achieved. Further, the molding and packing of a thermally conducting mold 1 is integrated and therefore, the dust resistance can be increased as well.SELECTED DRAWING: Figure 3
Inventors:
SHIONO RYOSUKE
SUKEOKA TERUAKI
SUKEOKA TERUAKI
Application Number:
JP2014225203A
Publication Date:
May 23, 2016
Filing Date:
November 05, 2014
Export Citation:
Assignee:
KITAGAWA IND CO LTD
International Classes:
H01L23/36; B29C39/02
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