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Title:
THERMALLY CONDUCTIVE ADHESIVE
Document Type and Number:
Japanese Patent JP2012126762
Kind Code:
A
Abstract:

To provide a thermally conductive adhesive that is excellent in thermal conductivity, can release stress generated under a thermal cycle etc., and can increase reliability of a semiconductor device.

The thermally conductive adhesive contains an epoxy compound having a structure represented by general formula (1), an epoxy group-containing acrylic polymer, an episulfide compound, a curing agent, and a thermally conductive filler, wherein the content of the episulfide compound relative to 100 pts.wt. of the epoxy compound represented by general formula (1) is not less than 1 pt.wt. and less than 30 pts.wt, and the content of the thermally conductive filler in 100 pts.wt. of the thermally conductive adhesive is 40-85 pts.wt. In general formula (1), m represents an integer of 2-4 and n represents an integer of 9-11.


Inventors:
MASUI RYOHEI
NAKAGAWA HIROAKI
KAKEHI TAKAMARO
YAMAGATA MASAHIKO
Application Number:
JP2010276804A
Publication Date:
July 05, 2012
Filing Date:
December 13, 2010
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J163/10; C09J9/00; C09J11/04; C09J11/06; C09J163/00; H01L23/40
Domestic Patent References:
JP2009221424A2009-10-01
JPH1036806A1998-02-10
JP2006117824A2006-05-11
JP2010013592A2010-01-21
JP2008045123A2008-02-28
JP2007294681A2007-11-08
JP2004359873A2004-12-24
JPH1135893A1999-02-09
JPH09241603A1997-09-16
JP2008045123A2008-02-28
JP2009221424A2009-10-01
JPH1036806A1998-02-10
JP2006117824A2006-05-11
JP2010013592A2010-01-21
JP2007294681A2007-11-08
JP2004359873A2004-12-24
JPH1135893A1999-02-09
JPH09241603A1997-09-16
Foreign References:
WO2010035459A12010-04-01
WO2010087444A12010-08-05
WO2010035459A12010-04-01
Attorney, Agent or Firm:
Atomi International Patent Office



 
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