To provide a thermally conductive composite material whose thermal expansion coefficient can be controlled to the value in a wide range close to that of semiconductor chips and various electronic equipment members while maintaining its sufficient thermal conductivity and high rigidity, and which has no strain caused by a difference in the thermal expansion coefficient with the parts to be combined.
The metal-ceramics composite material is obtained by dispersing the powder and/or fiber of SiC into a matrix of an Si-Al alloy, and has thermal conductivity of >150 W/mk. Preferably, the Al content in the Si-Al alloy lies in the range of 0.5 to 90 mass%, and the packing ratio of the SiC lies in the range of 40 to 80 vol.%. By controlling the packing ratio of the SiC in the composite material and/or the Al content in the Si-Al alloy, the thermal expansion coefficient of the composite material is controlled to the desired value in the range of 2.7×10-6 to 17.4×10-6/°C.
AOKI ICHIRO
TAKEI YOSHIBUMI
SHIOGAI TATSUYA
| JPH11171672A | 1999-06-29 | |||
| JPH11116361A | 1999-04-27 | |||
| JPH11509480A | 1999-08-24 |
| WO2000076940A1 | 2000-12-21 |