To obtain a thermally conductive epoxy resin molded form exerting high thermal conductivity, and to provide a method for producing the same.
The thermally conductive epoxy resin molded form is obtained by curing an epoxy resin-containing epoxy resin composition. In this molded form, the degree of orientation α of the epoxy resin is ≥0.5 but <1.0. The degree of orientation α is determined based on the formula(1) by X-ray diffractometry, wherein the formula(1) is as follows: α=(180-Δβ)/180 ( wherein, Δβ is the half-width in the intensity distribution ranging from 0 to 360° in the azimuthal angle direction based on fixing the peak scattering angle by X-ray diffractometry ). In the epoxy resin composition, the epoxy resin is preferably a mesogenic group-bearing liquid crystalline one.
ISHIGAKI TSUKASA
KIMURA TORU
SHIMOYAMA NAOYUKI
AOKI HISASHI
OCHI KOICHI
Makoto Onda