Title:
熱伝導性材料、マイクロエレクトロニクス装置、熱伝導性材料を形成する方法及びマイクロチップから熱を伝導して取り去る方法
Document Type and Number:
Japanese Patent JP4202923
Kind Code:
B2
Abstract:
A porous, flexible, resilient heat transfer material which comprises network of metal flakes. Such heat transfer materials are preferably produced by first forming a conductive paste comprising a volatile organic solvent and conductive metal flakes. The conductive paste is heated to a temperature below the melting point of the metal flakes, thereby evaporating the solvent and sintering the flakes only at their edges. The edges of the flakes are fused to the edges of adjacent flakes such that open pores are defined between at least some of the adjacent flakes, thereby forming a network of metal flakes. This network structure allows the heat transfer material to have a low storage modulus of less than about 10 Gpa, while having good electrical resistance properties.
Inventors:
Lassier, Ignatius Jei
Application Number:
JP2003543099A
Publication Date:
December 24, 2008
Filing Date:
October 18, 2001
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
H01L23/36; B22F3/11; H01L23/373
Domestic Patent References:
| JP7118701A | ||||
| JP59178754A | ||||
| JP56013403A | ||||
| JP5343572A | ||||
| JP10270858A | ||||
| JP2000096031A |
Attorney, Agent or Firm:
Yoshio Kawaguchi
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura
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