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Title:
THERMALLY CONDUCTIVE POLYMERIC COMPOSITION AND THERMALLY CONDUCTIVE MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2002088256
Kind Code:
A
Abstract:

To provide a thermally conductive polymeric composition which has excellent thermal conductivity and is suitable for heat-dissipating members, heat transfer members or materials for constituting them in electronic equipment and the like, and a thermal conduction molded product.

The graphitized carbon fiber to be incorporated into a thermally conductive polymeric composition has a spacing (d002) of graphite layers, measured by the X-ray diffraction method, of <0.3370 nm and, at the same time, a peak intensity ratio (P101/P100) of the (101) diffraction peak (101) to the (100) diffraction peak of ≥1.15. This graphitized carbon fiber can be obtained by conducting each treatment of spinning with the use of a mesophase pitch as the raw material, rendering the resulting fiber infusible, and carbonization in the order named, then effecting pulverization and subsequent graphitization, and has a fiber diameter of 5-20 μm and an average particle diameter of 5-500 μm. The thermally conductive polymeric molded product can be obtained by molding the thermally conductive polymeric composition into a specified shape.


Inventors:
HIDA MASAYUKI
Application Number:
JP2000281702A
Publication Date:
March 27, 2002
Filing Date:
September 18, 2000
Export Citation:
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Assignee:
POLYMATECH CO LTD
International Classes:
C08J5/00; C08K7/06; C08L101/00; C09K5/08; D01F9/145; H01L23/373; (IPC1-7): C08L101/00; C08J5/00; C08K7/06; C09K5/08; H01L23/373
Domestic Patent References:
JPH02163137A1990-06-22
JPH09320593A1997-12-12
JP2000164215A2000-06-16
JP2000192337A2000-07-11
JP2002033104A2002-01-31
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)