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Title:
THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY-CONDUCTIVE SHEET-LIKE MOLDED PRODUCT, AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2006089664
Kind Code:
A
Abstract:

To provide an acrylic thermally-conductive pressure-sensitive adhesive composition not giving an unpleasant feeling to the sense of smell of a human, and to provide an acrylic thermally-conductive sheet-like molded product.

This thermally-conductive pressure-sensitive adhesive composition contains an (meth)acrylic acid ester copolymer (A), a thermally-conductive inorganic compound (B) in an amount of 70-170 pts.wt. based on 100 pts.wt. of the (meth)acrylic acid ester copolymer (A), and a perfume (C). The thermally-conductive sheet-like molded product is composed of a base material and a layer of the thermally-conductive pressure-sensitive adhesive composition formed on one or both of surfaces of the base material.


Inventors:
EGAWA RIYOUKO
MORI HINAO
Application Number:
JP2004000278905
Publication Date:
April 06, 2006
Filing Date:
September 27, 2004
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C09J133/08; C09J5/08; C09J7/00; C09J11/00; C09J151/00; C09K5/08