Title:
熱伝導性パテ組成物、並びにそれを用いた熱伝導性シート及び放熱構造体
Document Type and Number:
Japanese Patent JP7331211
Kind Code:
B2
Abstract:
To provide a heat-conductive putty composition which can deform following a surface shape of a heat-generating article and can exhibit high heat conductivity (heat-dissipating and heat-providing properties).SOLUTION: A heat-conductive putty composition comprises a base polymer, which is a liquid polybutadiene having a hydroxy group, and a heat-conductive filler. The content of the heat-conductive filler is 500 pts.mass or more and 3000 pts.mass or less relative to 100 pts.mass of the base polymer.SELECTED DRAWING: None
Inventors:
Keiko Ashida
Yuu Nakahara
Yuu Nakahara
Application Number:
JP2022113370A
Publication Date:
August 22, 2023
Filing Date:
July 14, 2022
Export Citation:
Assignee:
Mitsubishi Cable Industries, Ltd.
International Classes:
C09K5/14; C08K3/22; C08K3/28; C08L47/00; C09D5/34; H01M10/613
Domestic Patent References:
| JP2008115356A | ||||
| JP2011099003A | ||||
| JP2011157428A | ||||
| JP2009503236A | ||||
| JP2017520633A | ||||
| JP2017530220A | ||||
| JP2017005166A |
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office
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