Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE SHEET
Document Type and Number:
Japanese Patent JP2002121393
Kind Code:
A
Abstract:
To provide a thermally conductive resin composition which excels in not only thermal conductivity but also flexibility and in adhesion to its application members.
The thermally conductive composition comprises a resin and a thermally conductive filler, and the thermally conductive filler is a mixture of a spherical thermally conductive filler and a nonspherical thermally conductive filler, and the particle diameter of the spherical thermally conductive filler is not more than five times the major axis particle diameter of the nonspherical conductive filler and, at the same time, the thermal conductivity of the spherical thermally conductive filler is not lower than that of the non-spherical thermally conductive filler.
Inventors:
HYOZU SHUNJI
MAKINO KOZO
NIKI AKIHIRO
MAKINO KOZO
NIKI AKIHIRO
Application Number:
JP2000312148A
Publication Date:
April 23, 2002
Filing Date:
October 12, 2000
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08J5/18; C08K3/28; C08K3/34; C08K3/38; C08K7/18; C08L33/04; C08L101/00; C09K5/08; H01L23/36; (IPC1-7): C08L101/00; C08J5/18; C08K3/28; C08K3/34; C08K3/38; C08K7/18; C08L33/04; C09K5/08; H01L23/36
Domestic Patent References:
| JP2000233452A | 2000-08-29 | |||
| JPH03200397A | 1991-09-02 | |||
| JPH08283456A | 1996-10-29 |
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