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Title:
THERMALLY CONDUCTIVE RESIN MOLDING, ITS MANUFACTURE AND USE
Document Type and Number:
Japanese Patent JP3721272
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To manufacture a highly flexible and highly thermally conductive heat dissipation member with good productivity by forming the member out of a resin molding which contains a thermally conductive filler and is easily deformed by an external force and forming it in a structure having communicating holes.
SOLUTION: The thermally conductive resin molding 1 is a molding containing thermally conductive filler 3 in a resin 2 or a resin molding to be easily deformed by an external force and containing communicating holes 4. The filler 3 contains BN particles. The resin 2 is a silicon. A shape of the molding is sheet-like. The holes 4 are formed in a thickness direction of the sheet with a porosity of a range 5 to 50%. Further, a ratio of the particles oriented in the thickness direction of the sheet is increased more than that of the particles oriented in a width direction of the sheet. Such the molding 1 is obtained by molding an uncured bar-like mold by using a resin composition containing the filler 3, providing air gaps to become a plurality of the holes 4, and accumulated. Thereafter, it is cut and cured.


Inventors:
Ikeda, Kazuyoshi
Sawa, Hiroaki
Otsuka, Tetsumi
Application Number:
JP1998000282239
Publication Date:
November 30, 2005
Filing Date:
October 05, 1998
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
H05K7/20; B29D22/00; B29D99/00; C08K3/38; C08L83/04; C08L101/00; H01L23/373; B29K83/00; (IPC1-7): B29D31/00; C08K3/38; C08L83/04; C08L101/00; H01L23/373; H05K7/20
Domestic Patent References:
JP8238707A
JP5198709A
JP8244094A