Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MEMBER USING THE SAME
Document Type and Number:
Japanese Patent JP2023112673
Kind Code:
A
Abstract:
To provide a thermally conductive silicone composition (gap fillers) having good adhesion to a base material, such as a heating element and a heat dissipation pair, excellent in heat dissipation properties due to high thermal conductivity, excellent in workability for application to the base material, excellent in shape retention properties after application, and being applied to the base material in an uncured state.SOLUTION: A thermally conductive silicone composition comprises: (A) a diorganopolysiloxane having an alkenyl group bonded to a silicon atom; (B) a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom; (C) a terpene phenolic resin; (D) a thermally conductive filler; and (E) an addition reaction catalyst. The silicone composition is applied to a base material in an uncured state.SELECTED DRAWING: None
Inventors:
TAKAHASHI AKIHIRO
SAKAI KAZUYA
YAMADA SHUNSUKE
SAKAI KAZUYA
YAMADA SHUNSUKE
Application Number:
JP2023005214A
Publication Date:
August 14, 2023
Filing Date:
January 17, 2023
Export Citation:
Assignee:
WACKER ASAHIKASEI SILICONE CO LTD
International Classes:
C08L83/04; C08L45/00
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