Title:
熱伝導性シリコーングリース組成物
Document Type and Number:
Japanese Patent JP5619487
Kind Code:
B2
Abstract:
A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 μm; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 μm; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 μm; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.
Inventors:
加藤 智子
中吉 和己
中吉 和己
Application Number:
JP2010143357A
Publication Date:
November 05, 2014
Filing Date:
June 24, 2010
Export Citation:
Assignee:
東レ・ダウコーニング株式会社
International Classes:
C08L83/07; C08G77/20; C08K3/22; C08K3/36; C08K5/5419; C09K5/08; C10M107/50; C10M113/12; C10M125/10