Title:
THERMALLY CONDUCTIVE SUBSTRATE
Document Type and Number:
Japanese Patent JP3548658
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the adhesion force, for example, between an insulating layer and an electrode by specifying the average diameter for the opening of the hole on the porous layer surface of an insulation coating, and directly providing, for example, an electrode in the hole and on the surface of the insulating layer.
SOLUTION: A substrate base is obtained by oxidizing an aluminum substrate base surface layer and generating anodized aluminum that is an insulating coating. The insulating layer of this substrate mainly consists of a double-layer structure that is made of a porous part which is made of an opening hole in terms of the form and a part which does not include a hole which is included between the porous part and the aluminum substrate base. An anodized aluminum insulating layer in this structure can be formed by using, for example, an oxalic acid bath and by performing the so-called porous-type anode oxidation. Especially, the average diameter of the hole of the opening of this sort of insulating layer surface is set to be in arrange of 15-25nm. An electrode or an electrical circuit consisting of, for example, the electrode is provided on the insulation layer and in the hole of the insulating layer.
Inventors:
Hitomi Owada
Kazushi Nakamura
Kazushi Nakamura
Application Number:
JP27761696A
Publication Date:
July 28, 2004
Filing Date:
September 27, 1996
Export Citation:
Assignee:
Taiheiyo Cement Co., Ltd.
International Classes:
H01L23/373; H01L35/16; H01L35/30; (IPC1-7): H01L35/30; H01L23/373; H01L35/16
Domestic Patent References:
| JP318088A |
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