Title:
熱膨張性マイクロカプセル及び発泡成形用組成物
Document Type and Number:
Japanese Patent JP7296946
Kind Code:
B2
Abstract:
The present invention provides a thermally expandable microcapsule having excellent heat resistance and high expansion ratio and enabling production of a light, high-hardness molded article having excellent physical properties (abrasion resistance), and a composition for foam molding containing the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell containing a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing silicon dioxide and a polymer obtained by polymerizing a monomer composition containing a carbonyl group-containing monomer, the thermally expandable microcapsule having a ratio of a peak intensity based on a C=O bond in the shell to a peak intensity based on the silicon dioxide in the shell (peak intensity based on C=O bond/peak intensity based on silicon dioxide) of 0.25 to 1.0 as determined by IR spectral analysis, the thermally expandable microcapsule having a maximum foaming temperature (Tmax) of 180°C to 225°C.
Inventors:
Yasuhiro Kawaguchi
Ken Kawakami
Shun Sato
Ken Kawakami
Shun Sato
Application Number:
JP2020513954A
Publication Date:
June 23, 2023
Filing Date:
January 24, 2020
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
Tokuyama Sekisui Industry Co., Ltd.
Tokuyama Sekisui Industry Co., Ltd.
International Classes:
C09K3/00; B01J13/18; C08F220/00; C08J9/32
Domestic Patent References:
| JP2013213077A | ||||
| JP2016169274A |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus