PURPOSE: To obtain a resin composition having extremely excellent thermal stability during molding and thermal deterioration resistance in the case of use in a high-temperature atmosphere without impairing appearance of molded article, mechanical properties, dimensional accuracy, fluidity in molding, solvent resistance and oil resistance.

CONSTITUTION: This resin composition comprises (A) 20-80 pts.wt. of a polyphenylene ether resin, (B) 80-20 pts.wt. of a polyamide resin, (C) 0.1-10 pts.wt. of a compatibilizing agent, (D) 0.05-3 pts.wt. of N,N'-hexamethylenebis(3,5- di-t-butyl-4-hydroxy-hydrocinnamide) and (E) 0.05-3 pts.wt. of tetrakis(2,4-di-t- butylphenyl) 4,4'-biphenylenediphosphonate.