THERMALLY STABLE AND SOLVENT-RESISTANT CONDUCTIVE POLYMER COMPOSITES

Title:

THERMALLY STABLE AND SOLVENT-RESISTANT CONDUCTIVE POLYMER COMPOSITES

Document Type and Number:

Japanese Patent JP2022017189

Kind Code:

A

Abstract:

To provide a conductive polymer composite having excellent conductivity, and excellent thermal stability and solvent resistance, and a manufacturing friendly preparation method for preparing the same.SOLUTION: The disclosed composite contains a doped electron rich host thiophene conjugated polymer and a crosslinkable silane network. The disclosed method includes a host thiophene conjugated polymer and a crosslinkable silane precursor, allowing simultaneously introducing both the dopant and the rigid cross-linked siloxane network into a polymer system.SELECTED DRAWING: Figure 1

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Inventors:

HE JIAZHI
YOU LIYAN
MEI JIANGUO

Application Number:

JP2021101659A

Publication Date:

January 25, 2022

Filing Date:

June 18, 2021

Export Citation:

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Assignee:

AMBILIGHT INC

International Classes:

C08L65/00; C08L83/04; H01B1/12; H01B1/14

Attorney, Agent or Firm:

Patent Business Corporation Oshima Patent Office

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