Title:
THERMOCOMPRESSION BONDING DEVICE AND METHOD OF WORK
Document Type and Number:
Japanese Patent JP3454154
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermocompression bonding device and a method of work, that can form a stable and uniform low-oxygen atmosphere around a junction part, and can stabilize junction quality.
SOLUTION: A porous member 12 with a breathing property is included between the lower surface of an elevating block 7 and a ceramic heater 13, and an electronic component 10 is pressed against a substrate by a thermocompression bonding tool 14 being brought into contact with the ceramic heater 13, and is subjected to thermocompression bonding by solder junction. In the case of the solder junction, an inert gas is supplied to the porous member 12, and the inert gas flowing from the side surface of the porous member 12 is introduced around the junction part of the electronic component 10 and the substrate by a cover member 9, thus forming a stable and uniform low-oxygen atmosphere around the solder junction part, and satisfactorily performing the solder junction.
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Inventors:
Kenichi Ohtake
Application Number:
JP18010398A
Publication Date:
October 06, 2003
Filing Date:
June 26, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/32; H01L21/60; H01L21/603; (IPC1-7): H01L21/603; H01L21/60
Domestic Patent References:
| JP9312314A | ||||
| JP4254338A | ||||
| JP6355949A | ||||
| JP945734A | ||||
| JP56158436A | ||||
| JP7201924A | ||||
| JP8162501A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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