To provide a base for thermocompression bonding mark completely releasable from a cloth such as a uniform, etc., by supplying a stripping agent form back of the cloth for stripping the mark base form the cloth like the uniform, etc.

The thermocompression bonding mark base is obtained by laminating a synthetic resin layer comprising a thermoplastic colored synthetic resin with flexibility and softness, on a surface of a releasing sheet, an inclusion layer comprising a thermoplastic resin layer free from effect of a releasing layer on the marker base and a hot melt resin layer having a melting point lower than that of the inclusion layer and the marker base. The thermocompression bonding mark is obtained by clipping the mark base from the thermoplastic hot melt resin layer to the mark base formed on the releasing sheet of a desired pattern in a half-cutting manner.