Title:
THERMOCONDUCTIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021036022
Kind Code:
A
Abstract:
To provide a thermoconductive adhesive sheet excellent in temporary adhesiveness and sheet performance, having a high thermal conductivity even under low-temperature sintering conditions, and capable of giving a semiconductor device excellent in reliability, and provide a semiconductor device having a semiconductor element bonded with the thermoconductive adhesive sheet.SOLUTION: A thermoconductive adhesive sheet is obtained by forming a resin composition containing (A) silver particles, (B) a thermosetting resin, and (C) a binder resin into a sheet. The silver particles (A) are secondary particles formed through aggregation of particles that contain primary particles having an average particle size of 10 to 100 nm.SELECTED DRAWING: None
Inventors:
ARAKAWA YOSUKE
OKANO KAZUTOMO
OKANO KAZUTOMO
Application Number:
JP2020033426A
Publication Date:
March 04, 2021
Filing Date:
February 28, 2020
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C09J7/35; B22F1/00; B22F7/08; C09J11/04; C09J133/00; C09J163/00; C09J179/04; H01B1/22; H01L21/52; H01L23/373
Domestic Patent References:
| JP2017095642A | 2017-06-01 | |||
| JP2017111975A | 2017-06-22 | |||
| JP2019050190A | 2019-03-28 | |||
| JP2018182294A | 2018-11-15 |
Foreign References:
| WO2019013231A1 | 2019-01-17 |
Attorney, Agent or Firm:
Otani patent office