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Title:
THERMOCONDUCTIVE SILICONE GREASE COMPOSITION
Document Type and Number:
Japanese Patent JP2006137930
Kind Code:
A
Abstract:

To provide a thermoconductive silicone grease composition which exerts a good heat-radiation effect.

The thermoconductive silicone grease composition, containing (A) 10-60% by volume of an organopolysiloxane which is expressed by formula (1): R1aSiO(4-a)/2 (wherein, R1s are each independently a 1-18C monovalent hydrocarbyl group; and a is in the range: 1.8≤a≤2.2) and which has kinetic viscosity at 25°C of 10-100,000 mm2/S and (B) 40-90% by volume of a copper powder which has an average particle diameter of 5.0-15.0 μm and an oxygen component content of less than 0.1% by mass, is characterized in that the mass of a coarse particle of 425 mesh (sieve opening: 32 μm) on is not more than 50 ppm in the thermoconductive silicone grease composition and a coarse particle of 325 mesh (sieve opening: 45 μm) on is substantially zero, and that thereby a good heat-radiation effect can be obtained.


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Inventors:
ENDO AKIHIRO
YAMADA KUNIHIRO
YOSHIDA KUNIHIKO
Application Number:
JP2005289529A
Publication Date:
June 01, 2006
Filing Date:
October 03, 2005
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L83/04; C08K3/08; C08K5/5415; C09K5/08; H01L23/373
Domestic Patent References:
JP2004210856A2004-07-29
JP2004075760A2004-03-11
JP2004091743A2004-03-25
JPH06242604A1994-09-02
JP2002003829A2002-01-09
JP2005330426A2005-12-02
JP2003309235A2003-10-31
JP2002371184A2002-12-26
JP2000109373A2000-04-18
JP2003301189A2003-10-21
JP2000169873A2000-06-20
JP2002327116A2002-11-15
JP2002003718A2002-01-09
JP2004010880A2004-01-15
JP2002015622A2002-01-18
JP2004161797A2004-06-10
JP2004262972A2004-09-24
JP2005205466A2005-08-04
JPH01261435A1989-10-18
JPH1112481A1999-01-19
JPH09100394A1997-04-15
JPH11246884A1999-09-14
JPH0297559A1990-04-10
JPH08208993A1996-08-13
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa



 
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