THERMOCONDUCTIVE SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE HAVING THE THERMOCONDUCTIVE SUBSTRATE

Title:

THERMOCONDUCTIVE SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE HAVING THE THERMOCONDUCTIVE SUBSTRATE

Document Type and Number:

Japanese Patent JP2003183792

Kind Code:

A

Abstract:

To provide a thermoconductive substrate which consists of a carbon fiber material and a highly thermoconductive metallic material, has satisfactory adhesion between both the materials, and has superior mechanical and thermal characteristics.

The thermoconductive substrate arranges a plurality of carbon fibers in the approximately same direction in a metal matrix, wherein the metal matrix includes a copper layer which coats at least a side wall of the carbon fibers, and a layer of an intermetallic compound of copper and tin for filling gaps among carbon fibers coated with the copper layer. The method for manufacturing the thermoconductive substrate which arranges the plurality of carbon fibers in the metal matrix, includes a step of forming the intermetallic compound so as to leave the copper layers around the carbon fibers.

Inventors:

OZAWA TAKUO
ITO TAKEFUMI
UMEMURA TOSHIO
MAEDA AKIRA
TERAMOTO HIROYUKI

Application Number:

JP2001387635A

Publication Date:

July 03, 2003

Filing Date:

December 20, 2001

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

B22D18/02; B22D19/00; B22D19/14; B22D23/00; C22C1/10; C22C47/04; C22C47/06; C22C47/08; C22C47/12; C22C49/12; H01L23/373; C22C101/10; C22C121/02; (IPC1-7): C22C49/12; B22D18/02; B22D19/00; B22D19/14; B22D23/00; C22C1/10; C22C47/04; C22C47/06; C22C47/08; C22C47/12; H01L23/373

Attorney, Agent or Firm:

Kaoru Aoyama (3 people outside)

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