Title:
熱電対取り付け構造および熱電対取り付け方法
Document Type and Number:
Japanese Patent JP7354057
Kind Code:
B2
Abstract:
A structure and a method for mounting thermocouple on an intermetallic compounds such as TiAl by suppressing occurrence of cracks are provided. A thermocouple mounting structure is provided with a substrate, a coating formed on the substrate and a foil joined on the coating, and sandwiches a thermocouple between the substrate and the foil. A thermocouple mounting method includes forming a coating on a substrate and welding a foil on the coating, and the welding includes arranging a thermocouple so that the substrate and the foil sandwiches the thermocouple. Occurrence of cracks in the substrate formed with intermetallic compounds can be suppressed by providing a thermal spray coating between the substrate and the foil.
Inventors:
Makoto Saito
Application Number:
JP2020093954A
Publication Date:
October 02, 2023
Filing Date:
May 29, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
G01K1/143; C23C4/073; G01K7/02
Domestic Patent References:
| JP201288171A | ||||
| JP5098389A | ||||
| JP6201476A | ||||
| JP2003269105A | ||||
| JP63183521U | ||||
| JP1145537A |
Attorney, Agent or Firm:
Takaharu Fujita
Takaori Mitoma
Miki Kawakami
Daisuke Nagata
Yoshimasa Kano
Keisaku Nakao
Takaori Mitoma
Miki Kawakami
Daisuke Nagata
Yoshimasa Kano
Keisaku Nakao
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