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Title:
THERMODE TOOL FOR BONDING OUTER LEAD OF IC OR THE LIKE
Document Type and Number:
Japanese Patent JPH07211748
Kind Code:
A
Abstract:

PURPOSE: To provide a quite new thermode tool, which is used for bonding the multitude of the outer leads of an IC or the like en bloc by pressure bonding the outer leads by heating or by ultrasonic fusion bonding the outer leads on a pattern, such as a printed board, is formed into a constitution, wherein a set number of sheets of thermode blades are stacked and are integrally constituted, and has a dimensional flexibility.

CONSTITUTION: A 1-mm thick flat plate-shaped thermode blade (a) of a structure, wherein a unit pressing part is provided on the upper part of a unit wheel part with a unit circular hole opened in the center and at the same time, a unit trowel part is formed under the lower part of the unit wheel part and the lower end surface of the unit trowel part is formed into a unit trowel surface 1', is provided and the set number of 30 sheets of the thermode blades are stacked as one block, and are integrally constituted, a thermode tool A, which consists of a wheel part 3, a pressing part 4 and a trowel part 5, is provided and a trowel surface 1 with a set number of the unit trowel surfaces 1' provided in series is formed on the lower end surface of the tool A. Moreover, the tool A is constituted into such a structure that with a coil 6 installed in a circular hole 2 formed in the part 3 of the tool A, cores 7 are installed on the outer periphery of the part 3 to heat electrically.


Inventors:
KUBOTA SHIGERU
KASAHARA MITSUHARU
Application Number:
JP1901794A
Publication Date:
August 11, 1995
Filing Date:
January 19, 1994
Export Citation:
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Assignee:
NITTO KOGYO KK
International Classes:
H01L21/60; H01L21/607; H05K3/32; (IPC1-7): H01L21/60; H01L21/607
Attorney, Agent or Firm:
Takao Kawasaki