Title:
熱電変換モジュール及びその製造方法
Document Type and Number:
Japanese Patent JP6668645
Kind Code:
B2
Abstract:
Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 µm and bonds the first metalized layer and the second metalized layer with the thermoelectric element.
Inventors:
Yuma Horio
Takahiro Hayashi
Takahiro Hayashi
Application Number:
JP2015174340A
Publication Date:
March 18, 2020
Filing Date:
September 04, 2015
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L35/08; H01L21/52; H01L35/14; H01L35/34
Domestic Patent References:
| JP2013168608A | ||||
| JP2013191838A | ||||
| JP2014204093A | ||||
| JP2014179375A | ||||
| JP2012134410A | ||||
| JP2013545278A | ||||
| JP2008028048A | ||||
| JP2011249442A |
Foreign References:
| US20150200345 | ||||
| US20130139866 |
Attorney, Agent or Firm:
Junichi Omori
Mitsuru Takahashi
Masayoshi Sekine
Shintaro Kanayama
Chiba Ayako
Shiraka Tomohisa
Mitsuru Takahashi
Masayoshi Sekine
Shintaro Kanayama
Chiba Ayako
Shiraka Tomohisa