Title:
THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015005595
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technology which can suppress peeling of a conductive contact part from a semiconductor layer and improve durability of a thermoelectric conversion module.SOLUTION: A thermoelectric conversion module comprises: a plurality of semiconductor layers having same polarity; an insulation layer arranged between a plurality of semiconductor layers; and a conductive part provided inside of the insulation layer and electrically connected to the semiconductor layer arranged on both sides of the insulation layer. The conductive part comprises: a conductive layer extending from one edge to the other edge of the insulation layer; and a conductive contact part projecting from the vicinity of the edge of the conductive layer and contacting with the semiconductor layer. At least part of the conductive contact part is embedded in a notch formed on the semiconductor layer.
Inventors:
TAKAKURA MASAHIRO
OMORI TSUNETSUGU
OMORI TSUNETSUGU
Application Number:
JP2013129431A
Publication Date:
January 08, 2015
Filing Date:
June 20, 2013
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H01L35/32; H01L35/22; H01L37/00
Attorney, Agent or Firm:
Patent business corporation Akinari international patent firm