Title:
THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015005596
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technology capable of increasing a temperature gradient in a semiconductor layer in a thermoelectric conversion module.SOLUTION: A thermoelectric conversion module having at least one of a heating surface and a cooling surface, comprises: a plurality of semiconductor layers having same polarity; an insulation layer arranged between a plurality of semiconductor layers; and a conductive part provided inside of the insulation layer and electrically connecting a side closer to the heating surface of the semiconductor layer arranged on one side of the insulation layer to a side closer to the cooling surface of the semiconductor layer arranged on the other side of the insulation layer. At least one of the heating surface and the cooling surface includes an insulation protective part. The protective part has a heat transmission protective part positioned in the vicinity of an edge of the semiconductor layer, and a heat insulation protective part positioned in the vicinity of the edge of the semiconductor layer. The heat thermal conductivity of the heat transmission protective part is larger than that of the heat insulation protective part.
Inventors:
TAKAKURA MASAHIRO
OMORI TSUNETSUGU
OMORI TSUNETSUGU
Application Number:
JP2013129446A
Publication Date:
January 08, 2015
Filing Date:
June 20, 2013
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H01L35/32; C01G51/00; H01L35/22; H01L35/30; H01L37/00
Attorney, Agent or Firm:
Patent business corporation Akinari international patent firm
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