To provide a thermoelectric conversion module capable of assuring a heat radiative performance and an endothermic performance, such as to maintain a trouble-free size for an electric wiring work (a wiring work), at mounting of electrodes.
A thermoelectric conversion module 1 includes a thermoelectric semiconductor element 2; an endothermic part insulation property substrate 3b constituting an endothermic part disposed facing each other so as to sandwich the thermoelectric semiconductor element 2; and a heat radiation insulation property substrate 3a constituting the endothermic part; and uses the peltier effect caused by current drawn in the thermoelectric semiconductor element 2 via the endothermic part insulating property substrate 3b and an electric wiring pattern 4 formed on the endothermic part insulating property substrate 3a; and electrical pads 5 for electrically connecting the thermoelectric conversion module 1 and the outside of the thermoelectric conversion module 1 with a surface other than the surface contacting the thermoelectric semiconductor element 2 of either or both of the endothermic part insulating property substrate 3b or the heat radiation part insulating property substrate 3a.
YAMANAKA TAKAYUKI
| JP2004111631A | 2004-04-08 | |||
| JP2003197988A | 2003-07-11 | |||
| JP2001160632A | 2001-06-12 | |||
| JP2006310818A | 2006-11-09 |
Yasuyuki Tanaka
Hiroshi Matsumoto
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