Title:
熱電変換モジュール
Document Type and Number:
Japanese Patent JP3552704
Kind Code:
B2
Abstract:
To improve connection reliability between a terminal and a lead wire when lead-free Au-Sn solder is used.
In a thermoelectric conversion module, respective thermoelements 3, lower electrodes 4 and an upper electrode 5 are bonded by Au-Sn (Au is not less than 50 mass %). The lead wires 10 are bonded to terminal parts 12 in the same way by Au-Sn (Au is not less than 50 mass %). The lead wires 10 are Au coated soft copper wires. The soft copper wire coated with a material selected from a group formed of Pd, Pt, Ni, Ag, Cr, Co, Ti, Ru and Rh can be used for the lead wire 10 or an Au wire can be used.
COPYRIGHT: (C)2003,JPO
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Inventors:
Nobuaki Tomita
Naoki Kamimura
Naoki Kamimura
Application Number:
JP2002042297A
Publication Date:
August 11, 2004
Filing Date:
February 19, 2002
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
B23K35/30; C22C5/02; H01L23/38; H01L35/08; H01L35/10; H01L35/32; (IPC1-7): H01L35/08; B23K35/30; C22C5/02; H01L23/38; H01L35/10; H01L35/32
Attorney, Agent or Firm:
Masanori Fujimaki