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Title:
THERMOELECTRIC MODULE
Document Type and Number:
Japanese Patent JP2012235092
Kind Code:
A
Abstract:

To provide a thermoelectric module which utilizes a thermoelectric element showing spin Seebeck effect.

Proposed in a new thermoelectric module comprising: a thermoelectric element formed by a thermoelectric material showing spin Seebeck effect; a first external electrode connecting with one side surface of the thermoelectric element and to which a positive voltage is applied; a second external electrode connecting with the other side surface of the thermoelectric element and to which a negative voltage is applied; an upper internal electrode layer which is embedded in an upper part of the thermoelectric element and mutually connecting with the first external electrode; and a lower internal electrode layer which is embedded in a lower part of the thermoelectric element and mutually connecting with the second external electrode.


Inventors:
CHOI DONG HYEOK
KIM YOUNG SUK
LEE SUNG HO
Application Number:
JP2012083647A
Publication Date:
November 29, 2012
Filing Date:
April 02, 2012
Export Citation:
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Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01L29/82; H01L37/00
Attorney, Agent or Firm:
Konobu Kato
Takafumi Oshima