Title:
THERMOELECTRIC MODULE
Document Type and Number:
Japanese Patent JPH09321353
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To minimize bending of thermally conductive ceramic boards due the thermal expansion by cutting at least one of these boards from its upper face to the bottom face to divide it into independent parts. SOLUTION: N-type and p-type semiconductor elements 1a, 1b connected through bonding plates 2 are disposed between two ceramic boards 3a, 3b made of a high thermal conductivity Al oxide. Metal-covered pads are provided on the inner surfaces of the ceramic boards 3a, 3b and the plates 2 are bonded to the pads 4. Cuts 5 are formed into the ceramic board 3a, 3b, from their surfaces to the bottom faces into independent parts. This minimizes the bending of the ceramic boards due to thermal expansion.
Inventors:
RUKIYAN IBUANOBUITSUCHI ANATEI
Application Number:
JP15476596A
Publication Date:
December 12, 1997
Filing Date:
May 28, 1996
Export Citation:
Assignee:
THERMO ELECTRIC DEIBEROTSUPUME
TAABARISHISHIIEESUCHI S AGURAN
TAABARISHISHIIEESUCHI S AGURAN
International Classes:
H01L35/16; H01L35/32; (IPC1-7): H01L35/32; H01L35/16
Attorney, Agent or Firm:
飯田 幸郷 （外１名）