Title:
THERMOELECTRIC POWER GENERATION DEVICE
Document Type and Number:
Japanese Patent JP2018093152
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoelectric power generation device in which bond strength is high between a thermoelectric power generation semiconductor element and an electrode material, junction reliability is ensured between the thermoelectric power generation semiconductor element and the electrode material even during use under high temperature environment, and thermal conductivity from the high temperature side and the low temperature side of a thermoelectric semiconductor is good.SOLUTION: An isolating layer 2a and a copper wiring layer 2b are formed on a metal plate as a support substrate 1 or on a planar substrate of a material having heat conductivity of 100 w/m k or more, and then multiple p-type thermal power generation semiconductors 3a and n-type thermal power generation semiconductors 3b are placed alternately while being coupled in series. An adhesive layer 9 also serving as an insulator is provided between the thermal power generation semiconductors 3a, 3b. An electrode material and two kinds of thermal power generation semiconductors are bonded by a metal bonding material 4, by using an electrode plate 5 having a heat resistant and oxidation resistant layer 6 on one high temperature heat source contact side, and the circuit 2b of the substrate and the low temperature side of the two kinds of thermal power generation semiconductors 3a, 3b are bonded by using lead-free solder on the low temperature side.SELECTED DRAWING: Figure 3
Inventors:
TAKAHASHI KAZUHIRO
KAJITANI TAKESHI
SAITO MASAHIKO
OKU KOICHI
KAJITANI TAKESHI
SAITO MASAHIKO
OKU KOICHI
Application Number:
JP2016247107A
Publication Date:
June 14, 2018
Filing Date:
December 02, 2016
Export Citation:
Assignee:
IMUKO CO LTD
International Classes:
H01L35/08; B22F3/105; B23K35/28; C22C22/00; C22C23/00; C22C24/00; H01L35/14; H01L35/32; H01L35/34
Domestic Patent References:
| JP2003282972A | 2003-10-03 | |||
| JP2000286464A | 2000-10-13 | |||
| JP2004228293A | 2004-08-12 | |||
| JP2015018853A | 2015-01-29 | |||
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