Title:
THERMOELEMENT MODULE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3930410
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve joint yield between a thermoelement and an electrode even when there is warpage in an insulating substrate or variation in the height of the thermoelement.
SOLUTION: A module is provided with; oppositely arranged insulating substrates 1, 7; electrodes 2, 8 which are, respectively, provided at the insulating substrates 1, 7; the P-type and N-type thermoelements 3, 4 which are located between the insulating substrates 1, 7 and electrically connected in series while thermally connected in parallel, with both ends jointed to the electrodes 2, 8, respectively; and holes 7a, 8a which are disposed at either one of the insulating substrates 1, 7 and at the electrode 8 of the insulating substrate 7, being permitted to communicate with each other. The ends of the thermoelements 3, 4 are inserted into the holes 7a, 8a of the insulating substrate 7 and the electrode 8, so as to be jointed to the electrode 8.
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Inventors:
Kazuki Tateyama
Tomohiro Iguchi
Ikuo Mori
Tomohiro Iguchi
Ikuo Mori
Application Number:
JP2002283525A
Publication Date:
June 13, 2007
Filing Date:
September 27, 2002
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L35/32; H01L35/08; H01L35/34; (IPC1-7): H01L35/32; H01L35/08; H01L35/34
Domestic Patent References:
| JP7022656A | ||||
| JP44016272Y1 | ||||
| JP8321637A | ||||
| JP6294562A | ||||
| JP62189774A |
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
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