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Patent Searching and Data


Title:
THERMOFORMABLE ACOUSTIC PANEL
Document Type and Number:
Japanese Patent JP2003140661
Kind Code:
A
Abstract:

To provide a flexible acoustic panel which can be molded and embossed, is highly acoustically absorptive and has a smooth and paintable surface and to provide the panel which is relatively durable and has a high NRC value when the panel is thin and the panel which is not sensitive with moisture and does not require coating or requires a back coating system in order to prevent the panel from sagging under a moist environment.

The acoustic panel including the material selected from the group consisting of multicomponent polymer fibers which are multicomponent fibers respectively having sheath layers substantially enclosing inner cores and including first polymers having the melting point lower than the melting point of second polymers forming the inner cores; slag cotton, fiber glass, cellulosic materials and their combinations.


Inventors:
CHRISTIE PETER A
WIKER ANTHONY L
SPRINGER BRIAN L
GARRICK JOHN R
HEISEY KENNETH E
Application Number:
JP2002266146A
Publication Date:
May 16, 2003
Filing Date:
September 11, 2002
Export Citation:
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Assignee:
ARMSTRONG WORLD IND INC
International Classes:
G10K11/162; B32B5/06; D04H1/42; D04H1/52; D04H1/54; D04H1/70; D04H5/06; D04H13/00; D21H13/40; D21H15/10; D21H25/04; E04B1/86; E04C2/16; G10K11/16; D21H13/14; D21H13/24; E04B1/76; E04B1/84; (IPC1-7): G10K11/162; G10K11/16
Attorney, Agent or Firm:
Shusaku Yamamoto (2 outside)