THERMOFORMING ELECTROMAGNETIC WAVE ABSORPTION MATERIAL

Title:

THERMOFORMING ELECTROMAGNETIC WAVE ABSORPTION MATERIAL

Document Type and Number:

Japanese Patent JP2007088388

Kind Code:

A

Abstract:

To provide a thermoforming electromagnetic wave absorption material that is easy to form and process, and has a high electromagnetic wave absorption capability after being formed even if it is a thin layer.

After having attached thermoplastic resin particles smaller than electromagnetic wave absorptive particles around the electromagnetic wave absorptive particles, heat treatment is done using a temperature higher than a glass-transition temperature of the thermoplastic resin. Further, as to this electromagnetic wave absorption material, the electromagnetic wave absorptive particles having gone through hydrophobic treatment are added to a thermoplastic resin manufacturing polymeric composite, which is suspension-polymerized in water liquid as suspension particles to accelerate the polymerization reaction.

Inventors:

KIMURA SHUICHI
EGASHIRA MAKOTO
YAGI KIYOSHI
KATO TAKAYUKI

Application Number:

JP2005278582A

Publication Date:

April 05, 2007

Filing Date:

September 26, 2005

Export Citation:

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Assignee:

YAZAKI CORP
UNIV NAGASAKI

International Classes:

H05K9/00; H01P11/00; H01Q17/00

Domestic Patent References:

JPH06130723A	1994-05-13
JPS5330680A	1978-03-23
JP2004127980A	2004-04-22
JP2004273751A	2004-09-30
JPH02252702A	1990-10-11
JP2003092207A	2003-03-28

Attorney, Agent or Firm:

Hideo Takino
Hiroshi Ochi
Sadao Matsumura
Isamu Kakiuchi

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