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Title:
THERMOFORMING METHOD OF FRICTION MATERIAL AND THERMOFORMING MOLD THEREFOR
Document Type and Number:
Japanese Patent JP2007015125
Kind Code:
A
Abstract:

To provide a thermoforming method of a friction material capable of efficiently discharging the gas formed during thermoforming, and a mold for molding the friction material used therein.

The thermoforming mold comprises a frame mold 6 having a piercing hollow part 6a, the press mold 5 arranged on one side of the hollow part and the receiving mold 7 arranged on the other side of the hollow mold and is constituted so that at least one of the press mold 5 and the receiving mold 7 is freely slid in the hollow part 6a of the frame mold 6. This thermoforming mold is used to charge a raw material of the friction material in the frame mold 6 and pressure is applied to the friction material by the press mold 5 and the receiving mold 7 to heat and mold the raw material. The frame mold 6 is divided into a plurality of parts and the pressure applied during thermoforming by the press mold and the receiving mold is reduced while a plurality of the divided frame molds are separated to discharge the gas formed during thermoforming from the gap between the separated frame molds.


Inventors:
CHIBA MASANORI
ISHII YASUJI
Application Number:
JP2005196037A
Publication Date:
January 25, 2007
Filing Date:
July 05, 2005
Export Citation:
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Assignee:
NISSHIN SPINNING
International Classes:
B29C43/02; B29C43/18; B29C43/36; B29C51/26; B29C51/30; B29L31/16
Domestic Patent References:
JP2003145568A2003-05-20
JPH07304090A1995-11-21
JPH11268061A1999-10-05
Attorney, Agent or Firm:
Kazuhiko Nakakura



 
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