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Title:
THERMOFORMING STYRENIC RESIN SHEET AND MOLDED ARTICLE MOLDED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2006176670
Kind Code:
A
Abstract:

To provide a sheet which is a thermoforming sheet composed of a styrenic resin capable of obtaining a molded article excellent in surface impact resistance, rigidity, and the engagement strength with a top cover, and a molded article using the same.

The thermoforming styrenic resin sheet is composed of a resin composition comprising 5-25 wt.% styrenic copolymer resin (A) which is a polymer obtained by anionic polymerization and has a composition ratio b/(a+b) of conjugated diene monomer (b) to [styrenic monomer (a)+conjugated diene monomer (b)] of 0.5-0.8, 55-80 wt.% polystyrene resin (B) substantially composed of a chain of a styrenic monomer alone, and 5-20 wt.% rubber modified polystyrene (C) obtained by graft polymerization of styrene on to a butadiene rubbery polymer which contains dispersed particles having polystyrene in its inside, an average particle diameter of 0.5 to 10 μm, and a content of the polystyrene of 75-90 wt.%.


Inventors:
IWATA TAKAAKI
MIZUTANI YOSHINORI
Application Number:
JP2004371906A
Publication Date:
July 06, 2006
Filing Date:
December 22, 2004
Export Citation:
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Assignee:
RISU PACK CO LTD
International Classes:
C08L25/06; C08L25/10; C08L51/04
Domestic Patent References:
JPS5730747A1982-02-19
JPH06184400A1994-07-05
JP2002283502A2002-10-03
JPH08193161A1996-07-30
JPH1081806A1998-03-31
JPS4734808B1
Attorney, Agent or Firm:
Takenori Hiroe
Kenichi Uno
Takanobu Takekawa
High Shinichi Ara
Nakamura Shigenori