THERMOFORMING OF THERMOPLASTIC RESIN SHEET

Japanese Patent JP3555332

B2

PROBLEM TO BE SOLVED: To easily eliminate a mold contact mark, which develops during the pushing-in process of a softened sheet in thermoforming, of a molded article by a method wherein the thermoforming of a thermoplastic resin sheet is performed with a mold under the condition that a silane compound layer is formed on the surface of the push member of the mold.
SOLUTION: Any mold push member such as the plug of plug-assist forming or the like, which is made of a material chemically bondable to a silicon-containing group in the molecules consisting of a silane compound formed on the surface of the member, will do. Concretely, aluminum, a ZAS alloy and a phenol-based or expoxy- based thermosetting resin are exampled. As the silane compound to be formed on the surface of the mold push member, a fluorine-containing silane compound represented by the formulae, in which Rf represents a 1-16C straight chain or a branched chain perfluoroalkyl group, X represents an iodine atom or hydrogen atom, Y represents a hydrogen atom or trifluoromethyl group, R1 represents a hydrolyzable group, R2 represents a hydrogen atom or inactive univalent organic group, (a), (b), (c) and (d) represent the integers from 0 through 200, (e) represents 0 or 1, (m) and (n) represent the integers from 0 through 2 and (p) represents the integer from 1 through 10, or the like.

Kokura Ltd.
Hachiro Yamada

JP13659296A

August 18, 2004

May 30, 1996

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Sumitomo Chemical Co., Ltd.

B29C33/38; B29C33/64; B29C51/30; (IPC1-7): B29C51/30; B29C33/38

JP50087162A
JP51017249A

Takashi Kuboyama

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