To provide a thermopile capable of performing easily pattern formation, and having high light-receiving sensitivity, and high reliability, and an infrared sensor using it.
A thermocouple 2 constituting the thermopile can perform easily pattern formation because it is formed of polysilicon (polysilicon part 21) and a metal (a metal member 22). Since the polysilicon is p-type polysilicon having high infrared absorptance, the light-receiving sensitivity is heightened. Each film thickness of a hot contact part 23a for connecting electrically the polysilicon part 21 to the metal member 22, a cold contact part 23b for connecting electrically the polysilicon part 21 to a metal member 22 of another thermocouple 2, and a wiring part 22a is thicker than the film thickness of the metal member 22. Furthermore, each width of the contact parts 23a, 23b is wider than the width of the metal member 22. Consequently, heat radiation from the metal member 22 is reduced, and decrease of a temperature difference between the contact parts 23a, 23b is prevented, to thereby improve the sensitivity. In addition, the thermopile has high reliability because wiring disconnection seldom occurs.
NOBE TAKESHI
NISHIKAWA HIDEO
Katsumi Taguchi
Shinichi Mizuta