Title:
THERMOPILE
Document Type and Number:
Japanese Patent JPH0434322
Kind Code:
A
Abstract:
PURPOSE:To simplify termination processing and producing processes by bonding inside a stem a heat sink to which adheres an insulating film having a thermocouple pattern and an infrared absorption layer formed thereon. CONSTITUTION:An insulating film 15 is boned on a surface opposite to a heat sink 13. A thermocouple pattern 17 is formed on one side of the insulating film 15 and an infrared adsorption layer 21 is formed on a surface opposite to that where the pattern 17. Inside a hole 19 of the heat sink 13, the infrared absorption layer 21 is formed on the insulating film 15 in an area containing a warm contact portion of the thermocouple pattern 17. A surface where the infrared absorption layer 21 is formed of the insulating film 15 is fixed tight on the opposite surface of the heat sink 13 by bonding in such a manner that the infrared absorption layer 21 is positioned almost at the center of the hole 19 of the heat sink 13.
Inventors:
SATO MASAHIRO
Application Number:
JP13984990A
Publication Date:
February 05, 1992
Filing Date:
May 31, 1990
Export Citation:
Assignee:
TOKIN CORP
International Classes:
G01J1/02; G01J5/02; G01J5/12; G01J5/14; (IPC1-7): G01J1/02; G01J5/02
Attorney, Agent or Firm:
Yosuke Goto (2 outside)
Next Patent: RESISTANCE THERMOMETER