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Title:
THERMOPLASTIC ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2023157869
Kind Code:
A
Abstract:
To provide a thermoplastic adhesive film which can be bonded at low temperature.SOLUTION: A thermoplastic adhesive film is composed of a resin composition containing (A) acid-modified high density polyethylene, (B) linear low density polyethylene, and (C) a polyethylene-based plastomer, wherein a weight ratio of the components (A) to (C) is 10 to 85: 5 to 30: 10 to 60, MFRs of the components (A) to (C) are 1.0-5.0 g/10 min, a difference between the maximum value and the minimum value among the MFRs of the components (A) to (C) is 3.0 g/10 min or less, the MFR of the resin composition is 1.0-4.0 g/10 min, and film thickness is 10-500 μm.SELECTED DRAWING: None

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Inventors:
KAMIYANAGI TAKUMA
Application Number:
JP2023064363A
Publication Date:
October 26, 2023
Filing Date:
April 11, 2023
Export Citation:
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Assignee:
AICELLO CORP
International Classes:
C09J123/26; C08L23/08; C08L23/26; C09J123/06
Attorney, Agent or Firm:
Yasuyuki Yamada
Masahiro Nakamura



 
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