レーザーダイレクトストラクチャリング用熱可塑性組成物

Title:

レーザーダイレクトストラクチャリング用熱可塑性組成物

Document Type and Number:

Japanese Patent JP7442250

Kind Code:

B2

Abstract:

A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.

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Inventors:

Tatsuya Kikuchi
Schlauben Bernardus Antonius Heraldus

Application Number:

JP2021521061A

Publication Date:

March 04, 2024

Filing Date:

November 06, 2019

Export Citation:

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Assignee:

Mitsubishi Chemical Corporation

International Classes:

C08L69/00; C08J5/00; C08J5/04; C08K3/22; C08L25/12; C08L51/04; C08L55/02; H05K1/03; H05K3/00; H05K3/18

Domestic Patent References:

JP2015520775A
JP2014530263A
JP2015108075A
JP2016097589A

Foreign References:

WO2015033955A1

Attorney, Agent or Firm:

Sykes Patent Attorney Corporation

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