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Title:
THERMOPLASTIC MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH07300542
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoplastic molding composition from which the binder can be removed within a short time when sintered by heating by mixing a ceramics with a specified antioxidant containing a hindered phenol or the like.

CONSTITUTION: This composition is prepared by mixing (A) a sinterable ceramics or metal with (B) thermoplastic binder containing (C) an antioxidant at the softening point of component B or higher. Component B is a mixture of a thermoplastic polymer with an organic wax, etc., and desirably has a softening point of 50-150°C. It is desirable that component C is effective at 200°C or above, and needs to have a boiling point of 250°C or above. Component C is desirably a hindered phenol or aromatic amine or one containing a divalent sulfur or trivalent phosphorus compound, and is used in an amount of about 0.01 to 5 wt.% based on component B. More desirably, 1-70 wt.%, based on component B, silicone resin is used. When sintered, this composition can give a non- defective highly dense object.


Inventors:
JIYON MITSUCHIERU FUGINZU
Application Number:
JP12296195A
Publication Date:
November 14, 1995
Filing Date:
April 25, 1995
Export Citation:
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Assignee:
BAYER AG
International Classes:
C04B35/632; C04B35/638; C08K3/01; C08K3/04; C08K3/14; C08K3/20; C08K3/08; C08K3/22; C08K3/28; C08K3/34; C08K3/36; C08K5/13; C08K5/17; C08L23/04; C08L83/04; C08L87/00; (IPC1-7): C08L23/04; C08K3/08; C08K3/22; C08K5/13; C08K5/17; C08L83/04
Attorney, Agent or Firm:
Heiyoshi Odashima