To provide a thermoplastic polyimide composition that can strike a balance between high thermal resistance and excellent film-forming properties.

The thermoplastic polyimide composition comprises: a thermoplastic polyimide A having a glass transition temperature of 100°C or larger, measured by a dynamic mechanical analysis (DMA); and a thermoplastic polyimide B having a glass transition temperature measured by the DMA, wherein the glass transition temperature of the thermoplastic polyimide B is lower than that of the thermoplastic polyimide A by 100°C or larger. Only one glass transition temperature derived from polyimide, measured by the DMA, is observed within the range of 23 to 260°C. Moreover, the thermoplastic polyimide B is 1-50 pts.wt. based on 100 pts.wt. of the thermoplastic polyimide A.