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Title:
THERMOPLASTIC POLYIMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004026944
Kind Code:
A
Abstract:

To provide a thermoplastic polyimide resin composition excellent in a balance between heat resistance and weld strength.

The thermoplastic polyimide resin composition comprises (A) a thermoplastic polyimide resin represented by formula (1) and (B) a thermoplastic polyimide resin having a half crystallization time of 50 min or longer. The half crystallization time (th) is defined as th = t0 - t1 [wherein t0 is the time necessary to rapidly cool the resin from a molten state to a specified temperature (ranging from Tg to Tm) in a DSC analysis; and t1 is the time taken before the top of an exothermic peak appears when the resin is crystallized by keeping it at Tc in the DSC analysis].


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Inventors:
KIDO TAKAYASU
YOSHIMURA MASAJI
ASANO MASAHIKO
YASUI MOTOYASU
Application Number:
JP2002183053A
Publication Date:
January 29, 2004
Filing Date:
June 24, 2002
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L79/08; C08G73/10; C08K3/00; (IPC1-7): C08L79/08; C08G73/10; C08K3/00
Domestic Patent References:
JPH1135822A1999-02-09
JP2000204249A2000-07-25
JP2000191907A2000-07-11
JPH11114744A1999-04-27
Foreign References:
WO2002084676A12002-10-24
Attorney, Agent or Firm:
Nobuyuki Kaneda
Katsuhiro Ito
Ishibashi Masayuki



 
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