Title:
THERMOPLASTIC POLYPHENYLSILSESQUIOXANE AND METHOD FOR PRODUCING HIGH-MOLECULAR WEIGHT POLYPHENYLSILSESQUIOXANE USING THE SAME
Document Type and Number:
Japanese Patent JP2003226753
Kind Code:
A
Abstract:
To provide a polyphenylsilsesquioxane having thermoplasticity which has excellent properties in heat resistance, electrical insulating properties, and hardness, and furthermore excels in solubility and thermoformability, and a method for producing a high-molecular weight polyphenylsilsesquioxane using the same.
The thermoplastic polyphenylsilsesquioxane has a weight average molecular weight, in terms of polystyrene, of 1,000-4,000 and a melting point of 140°C-200°C, and the method for producing a high-molecular weight polyphenylsilsesquioxane comprises subjecting the above thermoplastic polyphenylsilsesquioxane to condensation reaction at a temperature of not lower than its melting point.
Inventors:
YAMAGUCHI HIDEKI
Application Number:
JP2002026000A
Publication Date:
August 12, 2003
Filing Date:
February 01, 2002
Export Citation:
Assignee:
KANSAI RES INST
International Classes:
C08G77/04; (IPC1-7): C08G77/04
Attorney, Agent or Firm:
Okazaki Toyono