Title:
THERMOPLASTIC POLYUREA, AND LAMINATED BODY USING THE SAME AND WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JP2012246339
Kind Code:
A
Abstract:
To provide a thermoplastic polyurea excellent in heat resistance, low dielectric property, insulation property and metal adhesiveness.
There are provided the thermoplastic polyurea for electric insulating materials, represented by general formula (1) (wherein, R is an aliphatic or alicyclic divalent group; the number of carbon atoms is 5-15), and having a melting point of 200-320°C; a laminated body comprising a metal layer and a resin layer, wherein the thermoplastic polyurea for the electric insulating materials is used as the resin layer; and a wiring substrate using the laminated body.
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Inventors:
HIOKI JUN
Application Number:
JP2011116972A
Publication Date:
December 13, 2012
Filing Date:
May 25, 2011
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08G71/02; B32B15/08; H05K1/03
Domestic Patent References:
JPS314546B1 | ||||
JPS4427912B1 | ||||
JPS3622150B1 | ||||
JPS41758B1 | ||||
JP2008106078A | 2008-05-08 | |||
JPS314546B1 | ||||
JPS4427912B1 | ||||
JPS3622150B1 |
Foreign References:
US2550767A | 1951-05-01 | |||
US5288766A | 1994-02-22 |