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Title:
THERMOPLASTIC POLYUREA, AND LAMINATED BODY USING THE SAME AND WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JP2012246339
Kind Code:
A
Abstract:

To provide a thermoplastic polyurea excellent in heat resistance, low dielectric property, insulation property and metal adhesiveness.

There are provided the thermoplastic polyurea for electric insulating materials, represented by general formula (1) (wherein, R is an aliphatic or alicyclic divalent group; the number of carbon atoms is 5-15), and having a melting point of 200-320°C; a laminated body comprising a metal layer and a resin layer, wherein the thermoplastic polyurea for the electric insulating materials is used as the resin layer; and a wiring substrate using the laminated body.


Inventors:
HIOKI JUN
Application Number:
JP2011116972A
Publication Date:
December 13, 2012
Filing Date:
May 25, 2011
Export Citation:
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Assignee:
UNITIKA LTD
International Classes:
C08G71/02; B32B15/08; H05K1/03
Domestic Patent References:
JPS314546B1
JPS4427912B1
JPS3622150B1
JPS41758B1
JP2008106078A2008-05-08
JPS314546B1
JPS4427912B1
JPS3622150B1
Foreign References:
US2550767A1951-05-01
US5288766A1994-02-22



 
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