Title:
熱可塑性ポリ尿素、ならびにそれを用いた積層体および配線基板
Document Type and Number:
Japanese Patent JP5780831
Kind Code:
B2
Inventors:
Jun Hioki
Application Number:
JP2011116972A
Publication Date:
September 16, 2015
Filing Date:
May 25, 2011
Export Citation:
Assignee:
UNITIKA LTD.
International Classes:
C08G71/02; B32B15/08; H05K1/03
Domestic Patent References:
| JP41000758B1 | ||||
| JP2008106078A | ||||
| JP31004546B1 | ||||
| JP44027912B1 | ||||
| JP36022150B1 |
Foreign References:
| US2550767 | ||||
| US5288766 |